Samsung has started the production of its highly efficient embedded multi-chip packaging (eMCP) memory for use in entry- and mid-level smartphones and tablets.
The South Korean electronics giant, also the world’s largest DRAM maker, will use 20nm and 30nm DRAM chips for eMCP.
“Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of EMCP solutions in 2012,” said Myungho Kim, VP of Memory Marketing and Device Solutions at Samsung Electronics.
The company will pack modules into embedded 4GB multimedia cards based on 20nm NAND memory for storage.
Cards will support several storage capacities such as 256MB, 512MB or 768MB of 30nm-class energy-efficient DDR2 DRAM with 1.066Gbps bandwidth.
Samsung Mass Producing Highly Efficient Embedded Multi-Chip Memory. Image: SamsungTomorrow via Flickr (CC)
Samsung touts its 30nm-class DRAM modules to consume a quarter less of power as opposed to 40nm-class modules while increasing chip making productivity by as much as 60 percent compared to the latter.
The entry- to mid-level smartphone market has grown proportions with phone makers such as ZTE gaining profits despite selling low-cost mobile devices.
The addition of Samsung’s new memory modules will allow phone makers to build handsets with more competitive prices.
5 
16 
603
Loading ...